The following US Patents relate to spin-coating and the creation of high quality photoresist and other types of coatings. I provide only a very short sentence about MY perception of the novelty of each patent. Then the link to the US Patent and Trademark Office should be used to find out more information. Clicking on the patent number in the table will load a PDF of the first page of the official patent. More complete information should be loaded from the USPTO site:
Click here to reach the US Patent and Trademark Office.
The list below* is NOT exhaustive, but it provides a nice glimpse
of existing technology. Enjoy!
* - Not updated since 2000
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US Patent Number
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Title of Patent
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Comment
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Semiconductor processing spray coating apparatus
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Ultrasonic spray head and rotating wafer
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Method of forming coating and apparatus therefore
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Dual nozzles: solvent pre-wet then coating solution
dispense
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Processing apparatus
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Edge-bead removal apparatus
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Film forming methods
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Solvent dispense around rim for selective removal
of coating – two solvents used – EBR
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Apparatus for spin coating, a method for spin coating
and a method for manufacturing semiconductor device
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Dual solvent and solution dispense format
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Photoresist coating process control with solvent
vapor sensor
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Controlled vapor pressure of solvent with sensor
in coating chamber to control.
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Acoustic wave enhanced spin coater
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Ultrasonic vibration to help get coating solution
into valleys and corners.
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Dispense nozzle design and dispense method
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Oblong nozzle, starts at edge and moves inward with
wafer rotating
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Apparatus for forming coating film for semiconductor
processing
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Coating discharged in a “band-like stream”. Includes
careful distance control
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Spin-on-glass process with controlled environment
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Has cover which allows for spinning in controlled
environment – specific to SOG
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Method of and apparatus for processing photoresist,
method of evaluating photoresist film, and processing apparatus using the
evaluation method
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Heated substrate spinning with following heating
and cooling steps.
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Spin coating method and apparatus for liquid carbon
dioxide systems
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All coating and coating removal where CO2 is used
as a liquid – broad coverage.
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Coating solution applying method and apparatus
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Multi-step speed control during dispense. Dispense
to more central region only.
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Method of providing uniform photoresist coatings
for tight control of image dimensions
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Uses multiple dispensing steps with leveling spins
to achieve desired thickness and flatness.
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Spin coating spindle and chuck assembly
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Bowl design to prevent solvent vapors from escaping
near the spindle near the wafer.
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Coating solution applying method and apparatus
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Several program step model. Fast-slow-fast
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Method and apparatus for controlling air flow in
a liquid coater
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Adjustable air gap above wafer with enclosed chamber.
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Soft impact dispense nozzle
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Includes skirt that directs fluid onto surface more
tangentially.
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Chemical dispensing system for semiconductor wafer
processing
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Aimed at edge-bead removal.
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Method and apparatus for improved coating of a semiconductor
wafer
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“frustroconical” surface below wafer surface prevents
solution from splashing onto backside of wafer.
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Method of removing coated film from substrate edge
surface and apparatus for removing coated film
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Edge bead removal process, involves rapid spray
drying of selected regions
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Coating film forming method and coating film forming
apparatus
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Thickness sensor feedback to adjust final spin speed
to get more accurate thickness.
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Coating method and apparatus for semiconductor process
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Dual nozzles – one with PR and one with solvent.
Solvent precedes and wets surface.
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Method and apparatus for spin-coating chemicals
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Lid for controlled air gap and back-side solvent
dispense around rim
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Method and apparatus for temperature controlled
spin-coating systems
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Careful temperature control in chamber to control
viscosity of coating fluid – chamber is also enclosed
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Process liquid dispense method and apparatus
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Dual stage dispense for low use and uniformity
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Method and apparatus for applying a layer of flowable
coating material to a surface of an electronic Component
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Spinning around two axes: first provides normal
force to fill crevasses, second provides lateral force to encourage spreading
– as for SOG
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Wafer spin coating system with photoresist pumping
unit check function
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Active sensing of photoresist dispense abnormalities
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Process and system for flattening secondary edgebeads
on resist coated wafers
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Edge-bead removal strategy: solvent introduced to
edge to soften PR then high RPM spinning to flatten the mounds.
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Apparatus and method for spin coating substrates
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Small gap spinning chamber with circumferential
fluid reservoir that drains when spinning stops.
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Apparatus for treating a substrate with resist and
resist-treating method
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Sealed spinning chamber/cup which co-rotates with
spinning wafer.
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Arrangement for treatment of wafer-shaped articles,
particularly silicon wafers
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Nozzle spray at edge to remove edge bead while wafer
is spinning.
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Method and apparatus for improved coating of a semiconductor
wafer
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Spray onto spinning wafer such that fluid outflow
is expected/desired.
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Process for wafer peripheral edge defect reduction
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Photoresist overlayer deposited on top and vertical
solvent jet directed at perimeter of spinning wafer. Then etchback.
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Process and system for flattening secondary edgebeads
on resist coated wafers
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Uses solvent stream and high speed rotation to flatten
bead.
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Method and apparatus for uniformly spin-coating
a photoresist material
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Planetary rotation system which allows multiple
spin heads rotating together about a secondary axis
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Detachable sponge device for spin-coating machines
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Sponge around rim catches solvent used in EBR and
other processes
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Planarization process using artificial gravity
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Centrifugation and other methods to get fluid to
settle into flat condition
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Spin coating bowl
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Details about airflow within catchment area for
spun off fluid
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Spin coating dispense arm assembly
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Dual dispense tubes and temperature control
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Coating solution applying method and apparatus
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Slow-medium-fast multistep dispense programming.
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Method and apparatus for spin-coating compact discs
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Curved inner walls on bowl with venting holes at
specified locations
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Spin process for highly conformal coatings
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Dispense at 500 RPM or less then programmed ramp
to 3000 RPM then further acceleration – gives better conformal coatings
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Use of mixtures of ethyl lactate and N-methyl pyrollidone
as an edge bead remover for photoresists
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Composition has good effectiveness and does not
smell too bad
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Method of forming a coating film and coating apparatus
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Enclosed bowl that spins with wafer – fixed gap
too.
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Compact disc spin coater
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Spinning bowl with lid that is partially closed
to control airflow during coating.
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Substrate processing apparatus and air supply method
in substrate processing apparatus
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Filtered air downdraft with faster velocity directly
over the spin coater to prevent particle redeposition
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Method for uniformly coating a semiconductor wafer
with photoresist
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Multistep process for dispensing photoresist with
slow-medium-fast-medium sequence with dispense during slow step.
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Method for coating a substrate with a coating solution
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Early high speed stage to wet wafer then smaller
amount of PR used in second dispense.
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Coating apparatus
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Multiple nozzles that move along line from center
of wafer outward.
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Spin coating bowl exhaust system
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Bowl with a drain configured to receive excess liquid
and vapor from the spin coating and an assembly configured to maintain
the drain at a negative pressure relative to the bowl.
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Spin-coating device
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Coating fluid is dripped onto the substrate, while
substrate/coater system are tilted away from vertical so coating solution
flows outward by gravity and centrifugal forces
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Substrate spin coating apparatus
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Open top spinner with forced air flow from below
too – and balanced to prevent backsplatter of PR droplets.
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Disk coating system
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Dual spinners and turntables for moving wafers around
– focused on the automation aspect
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Resist processing apparatus for a rectangular substrate
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Edge bead removal by solvent spray around rectangular
perimeter
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Spin-on-glass process with controlled environment
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Covering circuit/SOG during spinning to provide
better gap filling and planarity.
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Gas barrier during edge rinse of SOG coating process
to prevent SOG hump formation
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Gas jet used in conjunction with liquid stripping
jet for edge bead removal
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Method of and apparatus for removing coating from
edge of substrate
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Edge bead removal apparatus
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Apparatus for improved coating of a CRT display
screen
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Attachment for use during spinning that provides
a controlled air-gap above CRT during spinning. Is curved to match shape
of face of picture tube.
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Striation-free coating method for high viscosity
resist coating
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Pre-wetting solvent during spin-up then application
of high viscosity solution during ramp-up and higher speed rotation.
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Coating apparatus
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Open wafer config. With waste solution and exhaust
vapor captured and separated in a tank below the spin chamber.
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Method of uniformly coating a substrate
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Solvent-vapor bearing gas is used surrounding the
chuck spinning system.
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Method of forming coating film and apparatus therefor
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Dual nozzle moveable dispense head system – solvent
first then coating solution
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Semiconductor processing spray coating apparatus
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Movable spray head and rotating wafer.
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Equipment and method for applying a liquid layer
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Dual dispense bottles for coating solution, one
at center and one further out.
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Method for removing photoresist composition from
substrate surfaces
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EBR solution compositions specified according to
C-chain length and functionality; also set for flash point above 100F.
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Resist Processing Method and Apparatus
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Processing step and cleaning step are combined and
overlapping to some degree. Involves coverage of “quadrilateral” object.
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Method for forming a thin uniform layer of resist
for lithography
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Includes vibration of wafer after dispense of solution
to remove voids in resist.
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Spin coating fixture
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Counterweighted grips for holding wafer during spinning
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Spin coating device
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Spin coater with air inlet, exhaust, and integrated
splatter guard.
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Proximity-dispensing high-throughput low-consumption
resist coating device
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Dispense in close proximity to wafer surface from
several nozzles to lower amount of resist usage
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Spin-on-glass planarization by a new stagnant coating
method
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SOG dispense strategy – stationary then slow then
fast – to help fill tight valleys between metal lines.
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Substrate coating apparatus
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Mainly specifics of valve connections for dispensing
parts of system – allowing for either gas or liquid cleaning solution to
be used at controlled temperature.
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Method of spiral resist deposition
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Moving inward while spinning the substrate
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Photoresist film coating method
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Inverting the wafer during high speed rotation for
improved conformal coatings of photoresist.
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Method and apparatus for forming film on surface
of disk
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Spray dispense and controlling rotation rate to
compensate for radius.
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Material-saving resist spinner and process
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Solvent vapor in coating chamber to reduce consumption
of resist.
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Edge bead removal gap gauge
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Way of measuring where EBR nozzle will be adjusted.
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Method of dispensing fluid onto a wafer
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Soft dispense nozzle that draws bubble-free fluid
from the bottom of the solution well and delivers it in close proximity
to the surface.
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Method for applying process solution to substrates
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Dual spin chucks in same spin-coater with single
dispense nozzle working both chucks.
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Optimized photoresist dispense method
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Complex dispense/spin-speed program cycle to optimize
photoresist usage.
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Hybrid pulsed valve for thin film coating and method
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Droplet generator coupled with gas jet to propel
droplets onto wafer surface.
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Method of spiral resist deposition
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Spiral dispense starting from edge and working inward
while rotating.
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Method and apparatus for manufacturing a semiconductor
device
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Reflected light from a bare region of wafer surface
is used to measure thickness of resist and to control processing steps
associated with lithographic line definition.
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Material-saving resist spinner and process
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Solvent vapor in coating chamber to reduce consumption
of resist.
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In situ resist control during spray and spin in
vapor
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Solvent saturated vapor with spray of coating solution.
Figure shows coating thickness measurement in real-time with glancing angle
light reflection.
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Method for low pressure spin coating and low pressure
spin coating apparatus
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Low pressure spin coating.
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Polyimidesiloxane solution and method of coating
substrates
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Aliphatic or cycloaliphatic substituted pyrrolidone
as spin coating solvent – prevents “whitening” of the coatings that occurs
with other solvents.
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Edge masking spin tool
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Edge-bead prevention via elastomeric ring around
substrate that extends flow region.
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Spin coating method
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Two axis spinning with tilt variations – includes
solvent vapor environment too.
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System and method for applying a liquid
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Discharge of the coating solution “like a curtain
toward a semiconductor wafer”.
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Film forming method by spin coating in production
of semiconductor device
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Water spray onto backside during polyimide deposition
to prevent backside contamination by polyimide.
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Spin coating apparatus
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Thin gap between wafer and co-rotating cover creating
a “flat treating space therebetween.”
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Spin coating apparatus with an independently spinning
enclosure
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Spinning “tub” over wafer spins independently –
and perhaps longer that the wafer. Also includes active air drafting and
control to prevent contaminants.
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Spin coating apparatus with an upper spin plate
cleaning nozzle
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Thin gap spinner includes cleaning nozzle for upper
surface of plate above wafer.
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Use of particular mixtures of ethyl lactate and
methyl ethyl ketone to remove undesirable peripheral material (e.g. edge
beads) from photoresist-coated substrates
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Use of ethyl lactate and MEK mixture to remove edge-bead
from wafer.
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Spin coating apparatus
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Sensing, filtering, and pre-processing coating solution
before deposition to ensure uniformity of coating.
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Liquid coating device
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Includes temperature matching to ambient via heater
in nozzle
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Method and apparatus for applying a coating material
to a substrate
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An annular air duct is disposed surrounding and
spaced in relation to the spinning chuck. Guide vanes provide positive
airflow through the coater.
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Spin coating apparatus using a tilting chuck
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Two axis spinning with tilt variations – includes
solvent vapor environment too.
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Method and apparatus for applying a layer of a fluid
material on a semiconductor wafer
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A rectangular or oblong shaped opening for the dispensing
nozzle to be able to paint a broad swath during dispensing. Nozzle moves
radially inward during dispense. This minimizes amount of fluid consumed
and provides a uniform coating.
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Coating apparatus and method for applying a liquid
to a semiconductor wafer including selecting a nozzle on a stand by state
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Plurality of nozzles provided, with each designed
for specific solution.
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Spin coating apparatus for forming a photoresist
film over a substrate having a non-circular outer Shape
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Co-spinning member that is angled to deflect ejecta
downward from spinning from the non-circular substrate.
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Method for production of electronic coatings
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Formulation to increase solubility of polyimide
for high quality coating, especially in high humidity.
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Method for improving photoresist on wafers by applying
fluid layer of liquid solvent
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Pre-wet of substrate with solvent then dispense
of photoresist while still spinning.
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Method and device for the uniformly even application
of a resin coating on a substrate
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Small cap that co-rotates and creates solvent environment
during spinning.
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Metallo-organic solution deposition (MOSD) of transparent
crystalline ferroelectric films
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Alkoxide recipe with three step heat treatment –
low temp to remove solvent – medium temp to densify and decompose – high
temp to crystallize.
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Spin Coating Apparatus
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Refrigerated coating solution for thermosetting
layer deposition. Includes heat exchanger to heat solution to the wafer’s
temp just before deposition.
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Spin coating method and device
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Substrate tilted and solution dispensed and spread
by gravity before spinning commenced.
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Method of forming a uniform resist film by selecting
a duration of rotation
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Duration of spinning at various speeds controlled.
Drying stage is at lower speed after spreading to desired thickness at
higher speed.
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Edge bead removal process for spin on films
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Pulsed or repeated application of solvent to the
edge and a backwash step.
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Method and apparatus for applying a layer of photosensitive
material to a semiconductor wafer
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Jet of liquid/solvent directed at edge of wafer
to remove collected coating solution there.
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Magnetic disk coating method and apparatus
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Thin air gap during spinning. Helium used during
high speed spinning to prevent “spoking”
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Coating thickness and wedge geometry control for
magnetic disks
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Cover during spinning prevents solvent evaporation
to produce a thinner magnetic coating.
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Apparatus for spin coating in the production of
thin magnetic layers for magnetic discs.
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Cover provided during spinning prevents streak formation
in coating layer.
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Spin coating process
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Solvent jet at back side to remove coating solution
that wicks around from top side.
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Novel resist spinning head
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Knife edge rim holding wafer down prevents resist
from leaving edge bead.
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Spin coating process for prevention of edge buildup
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Frame provided around wafer to act as “auxiliary
surface to allow a continuous film of the fluid to be spin coated.”
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Dunbar
P. Birnie, III
Professor
Department of Materials Science and Engineering
Rutgers, The State University of New Jersey
607 Taylor Rd.
Piscataway, New Jersey, 08854-8065
Major revisions installed in December 2004
Based on earlier version from July 2000
Updated in February 2005.
Page started 1 May 1998
(c) 1998,1999,2000,2004,2005 D. P. Birnie, III